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Course Overview | ||
This 5-day electrodeposition course thoroughly and systematically covers the fundamentals, processes, and applications of electroplating, electroless plating, immersion plating, electroforming, anodizing, and electrophoretic deposition (of ceramics and paints). Participants will learn the fundamentals of electrodeposition processes, the effects of process variables on the plating quality, and the various plating techniques such as DC electroplating, pulse electroplating, electroless plating and immersion plating. Modern techniques for the testing and evaluation of electrodeposits and practical methods for trouble-shooting electroplating and electroless plating baths are also presented in this short course.
This electroplating course can be taken as in-house training course, course-on-demand, online course and distance learning course worldwide. It can also be customized to meet the specific needs of your organization.
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Course Outline | ||
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1.1 Overview of Electroplating Technology 1.2 Electroplating: Basic Terms and Concepts 1.2.1 Primer on Chemistry 1.2.2 Redox Reactions 1.2.3 The Electromotive Force (EMF) Series
1.2.4 Equilibrium Potential, Overpotential
1.2.5 Effect of Concentration on
Potential 1.2.6 Anode, Cathode and Cell Potentials 1.2.7 Conductivity of Electrolyte 1.2.8 Electrolysis and Faraday’s Law 1.3 Electroplating: Electrode Kinetics 1.3.1 Kinetics of Electrodeposition (Tafel & Butler-Volmer Equation) 1.3.2 Polarisation and Mass Transport (Diffusion) 1.3.3 The Double Layer 1.3.4 Rate-Determining Steps in Electrode Reactions Concentration Overvoltage Charge-Transfer Overpotential Crystallisation Overvoltage Resistance Overvoltage 1.4 Materials That Can Be Electroplated: Understanding the Atomic Structure of Metals and Alloys 1.4.1 The Crystalline Nature of Metals 1.4.2 Lattice Defects in Metals 1.4.3 Grains and Grain Boundaries 1.4.4 Lattice Defects in Alloys 1.4.5 Effect of Lattice Defects on the Mechanical Property 1.4.6 Metals That Can Be Electrodeposited 1.5 Electroplating Processes and Process Control 1.5.1 Overview of Electrodeposition 1.5.2 Essential Components of a Plating System 1.5.3 The Nature of Plating Process 1.5.4 Electroplating Electrolytes 1.5.5 Mass and Current Relationship 1.5.6 Current Efficiency 1.6 Exercises and Case Studies
2.1 Electrodeposition Considered at the Atomistic Level 2.1.1 Mechanisms of Electrodeposition 2.1.2 Electrocrystallisation: Nucleation and Growth of Nuclei 2.1.3 Kink Site and Surface Imperfections 2.1.4 Overall Phase Growth 2.1.5 Effects of Plating Additives on the Structure and Properties of Electrodeposits 2.1.6 Other Factors Influencing the Quality of Electrodeposits 2.1.7 Thickness and Porosity 2.1.8 Whisker Growth 2.2 Different Plating Processes 2.2.1 Direct Current Electroplating 2.2.2 Pulse Current Electroplating Process 2.2.3 Periodic Pulse Reverse Plating Process 2.2.4 Effects of Pulse Current, Pulse Shape and Time on the Electrodeposits 2.2.5 Laser-induced Plating 2.2.6 Comparison of Different Plating Processes 2.3 Electroless Plating and Immersion Plating 2.3.1 Fundamentals of Electroless Deposition 2.3.2 Composition of Electroless Plating Bath 2.3.3 Operating Conditions of Electroless Plating Baths 2.3.4 Properties of Electroless Deposits 2.3.5 Applications of Electroless Deposition 2.3.6 Electroless Deposition of Composites 2.4 Exercises and Case Studies 2.5 Electrophoretic Deposition 2.5.1 Introduction to Electrophoretic Deposition 2.5.2 Mechanisms of Electrophoretic Deposition 2.5.3 Kinetics of Electrophoretic Deposition 2.5.4 Applications of Electrophoretic Deposition
3.1 Surface Preparation of Substrate
3.1.1
Importance of Surface Preparation 3.2 Selection of Plating Materials 3.2.1 Decorative Properties 3.2.2 Solderability and Weldability 3.2.3 Antifriction Properties 3.2.4 Corrosion Resistant Properties 3.2.5 Electrical Contacts and Conductivity 3.2.6 Hardness and Wear Resistant Properties 3.2.7 Other Properties 3.2.8 Thickness of Electrodeposits 3.3 Selection of Plating Bath 3.4 Electroplating of Copper and Copper Alloys 3.5 Electroplating of Silver and Its Alloys 3.6 Electroplating of Gold and Its Alloys 3.7 Electroplating of Nickel and Its Alloys 3.8 Electroplating of Tin, Lead, Cadmium and Their Alloys 3.9 Electroplating of Zinc and Its Alloys 3.10 Electroplating of Chromium 3.11 Electroplating of Iron and Its Alloys 3.12 Electroplating of Palladium and Platinum 3.13 Exercises and Case Studies
4.1 Electroless Deposition of Copper 4.2 Electroless Deposition of Nickel 4.3 Electroless Deposition of Silver 4.4 Electroless Deposition of Gold 4.5 Electroless Deposition of Palladium and Platinum 4.6 Electroless Deposition of Alloys 4.7 Properties of Electrodeposited Metals and Alloys 4.7.1 Electrical and Electronic Properties 4.7.2 Mechanical Properties 4.7.3 Porosity and Thickness of Deposit 4.7.4 Corrosion Resistance Properties 4.7.5 Solderability and Weldability 4.8 Electroplating Process Control and Chemical Analysis of Plating Solutions 4.8.1 Plating Solution Make-up and Analysis Techniques 4.8.2 Current Density, pH, Temperature and Conductivity 4.8.3 Cathode Efficiency and Anode Efficiency 4.8.4 The Hull Cell Test 4.8.5 Covering Power and Throwing Power 4.8.6 Process Monitoring 4.9 Methods for Testing and Evaluation of Electrodeposits4.9.1 In-situ Observation of Electrodeposition by SPM/STM/SFM 4.9.2 DC Potential Measurement 4.9.3 DC Polarization Measurement 4.9.4 AC Electrochemical Impedance Spectroscopy (EIS) 4.9.5 Mass Spectrometric Methods: ISS/SIMS/SNMS 4.9.6 Electron Spectroscopic Methods: XPS/ESCA/AES |